Industries Commonly Utilize Stacked Via Services
A stacked via is a type of connection within a printed circuit board that stacks vertically. Stacked vias are used in high-density interconnect (HDI) PCBs to make connections between layers that do not have direct, horizontal alignment. They also help streamline trace routing pathways and reduce circuit congestion compared to other connecting methods. Stacked vias are available in both blind and buried varieties and require an intricate manufacturing process.
Conventional stacked via are round holes that pierce through an entire layer of insulating material and connect to the copper on the other side. The via is then plated with copper and filled with dielectric. This creates an electrical path through the insulator between the copper layers of the circuit board. Conventional vias are useful in a variety of applications, including mounting ICs and other components on the PCB and connecting them to external wires.
Microvias are smaller than conventional vias and are used in a variety of applications in electronic devices, including mobile phones, tablet computers, and laptops. They are created by lasers that drill small, circular holes in the outermost layer of the circuit board. The resulting hole is then filled with conductive material and plated with copper. This creates an electrical connection between the innermost and outer layers of the circuit board. Microvias are used in high-density PCBs, reducing the number of layers needed to create a circuit board. They are also able to support higher frequencies than regular vias.
What Industries Commonly Utilize Stacked Via Services?
Stacked vias are a more complex way to create a PCB than microvias, requiring additional steps in the manufacturing process to ensure a quality result. For example, they require a more precise drilling technique to avoid voids or uneven plating. They also must be properly designed to ensure the integrity of the connections. This can be challenging for some designers, but is a vital step in ensuring the reliability of a stacked via.
There are a few factors that can cause problems with stacked vias, including inconsistent hole wall thicknesses, incomplete copper deposition, and insufficient dielectric fill. These issues can lead to a lack of continuity between the circuit board layers, which can impact signal integrity and other crucial electrical properties. It is important to avoid these issues as much as possible, especially if you are using stacked vias in a high-speed application.
Stacked vias offer a significant advantage in terms of cost and space when compared to other types of connections, such as through-hole and blind/buried vias. They are a great option for high-speed, dense circuit boards that require vertical connections between multiple layers. However, if not designed and built correctly, they can increase the risk of signal interference and increase the time required to troubleshoot errors. It is important to work with a professional PCB designer who is experienced in the design and fabrication of high-density PCBs. With the right expertise, you can rest assured that your stacked vias will perform well in your next project.
